Business Wire
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Powering Up Panel-Level Packaging! Capcon’s Die Bonder Wins Bulk Adoption by Internationally Leading IDM Giant
SINGAPORE–(BUSINESS WIRE)–Recently, Capcon’s large panel-level packaging die bonder, AvantGo L6 (Leo), has been adopted in bulk by an internationally-leading IDM manufacturer and mass producer. It is believed that with the bulk application of AvantGo L6…
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